RF and Microwave Microelectronics Packaging II

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RF and Microwave Microelectronics Packaging II

by Ken Kuang , Rick Sturdivant

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First published: 2017 ISBN: 9783319847191

Subjects

Microelectronics Microwave communication systems Engineering Microelectronic packaging TECHNOLOGY & ENGINEERING Mechanical Instrumentation Electronics and Microelectronics RF and Optical Engineering Microwaves Circuits and Systems Technology & Engineering

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