Substrate Interconnects Noise Immunity and Electro-Thermal Analysis in Bulk Silicon Technology for Three-dimensional Circuits View on Open Library

Substrate Interconnects Noise Immunity and Electro-Thermal Analysis in Bulk Silicon Technology for Three-dimensional Circuits

by Yue Ma , Christian Gontrand

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First published: 2019 1 language ISBN: 9780367023430
Subjects
Electronic circuit design

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