by John H. Lau
No reviews yet. Be the first!
Semiconductor Advanced Packaging
Fan-Out Wafer-Level Packaging
Electronics manufacturing
Electronic packaging
Chiplet Design and Heterogeneous Integra...
Heterogeneous Integrations
Fatigue life analyses of welded structur...
U-groove aluminum weld strength improvem...
Quality assurance of welded construction
Brazing
Introduction to the Nondestructive Testi...
Fitness-for-service criteria for assessi...