by John H. Lau , C.P. Wong , J.L. Prince
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Semiconductor Advanced Packaging
Fan-Out Wafer-Level Packaging
Solder joint reliability
Electronics manufacturing
Chiplet Design and Heterogeneous Integra...
Heterogeneous Integrations
The Psychology of Everyday Things
Encyclopedia of Thermal Packaging
Practical Guide to the Packaging of Elec...
Electronic techniques
Introduction to microsystem packaging te...
Semiconductor packaging